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Fluon+ ADHESIVE are fluorinated adhesive resins made with Fluon ETFE or PFA. They are used in applications requiring strong adhesion to plastics and metals. These compounds also exhibit high permeation resistance to many fluids and gases, especially automotive fuels.

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Applications

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Various hoses and pipe inner walls
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Laminating film
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Materials for printed circuit boards

Main Product Types

Standard resin

Properties Unit LH-8000 AH-5000 AH-2000 AH-800 AH-700 EA-2000
MFR g / 10min 4 26 25 25 13 16
Specific gravity - 1.75 1.76 1.78 1.73 1.73 2.13
Melting point °C 190°C 225°C 245°C 255°C 258°C 300°C

Conductive resin

Properties Unit AH-600C AH-3000L AH-800C AH-700C
MFR g / 10min 4 6.5 5.5 2
Specific gravity - 1.76 1.77 1.75 1.75
Melting point °C 230°C 240°C 255°C 258°C
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Fluon+™ EA2000

Adhesive Fluon+ EA-2000 resin is drawing a lot of attention as a material for 5G-compatible printed circuit boards that are used in higher frequency bands. While retaining the excellent inherent characteristics of fluoropolymers such as heat resistance and electrical characteristics, Fluon+ EA-2000 provides superior adhesion, which enhances processing capabilities and the reliability of printed circuit boards.
In addition, Fluon+ EA-2000 makes it possible to enhance the electrical characteristics of materials by being overlayed or dispersed on other materials.

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Main Product Types

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Products Features
Fluon+ EA-2000 Film Thickness: 12μm 25μm 38μm 50μm 75μm
Fluon+ EA-2000 Powder Particle size D50: 2~3μm (10kg/package)
Fluon+ EA-2000 Dispersion Solvent: NMP , Solid content: 50wt% (15kg/package)

Features

  • Low dielectric constant (2.0) and low dissipation factor (0.001)
  • Excellent adhesion to smooth copper foils – Minimize loss and delay for high frequency applications due to the skin effect
  • Stable dielectric constant versus temperature and frequency
  • Very low moisture uptake (0.03%)

Applications

Material for CCL/FCCL:

  • Automotive radar applications
  • 5G cellular telecommunication systems – power amplifiers and antennas
  • Other mmWave applications

Adhesiveness toward copper foil

Roughness (Rz) Peeling strength (kN/m)
Electrolytic copper foil (ED) 1.2um 1.5
Rolled copper foil (RA) 0.4um 1.2

Dk and Df

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Comparison of transmittance loss in
high-frequency area

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EA-2000 reduces
15% loss @28GHz
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EA-2000 reduces
17% loss @28GHz